Applications
OLB and PWB Bonding Machine XCH78-A6 is suitable for the side hot pressing combination bonding process of FOG, OLB, FOB, PWB of borderless full display LCD panel, FPC, COF and PCB.
Introductions
- Power on and reset, the device returns to the origin.
- Click the HMI to enter the automatic mode.
- Manually load from the left, position the X and Y positioning cards, press the vacuum, the side platform adsorbs the panel; press the start button, the clamping cylinder extends and clamps.
- The panel platform automatically moves to the visual mechanism, automatically calibrates X-Y-θ, and the height measurement is turned on after the calibration is completed.
- After the height measurement is completed, the platform reaches the CCD photo position, the manual COF alignment, and after the alignment is OK, it reaches the bottom of the pressure head.
- After the current pressing is completed, move to the next COF bonding position.
- After COF bonding is completed, switch to PCB bonding according to needs.
- Place the PCB on the fixture platform, and after the panel is positioned, align the COF and PCB.
- Manually adjust the PCB fixture X-Y-θ for alignment, and after the alignment is OK, return to the bottom of the pressure head and press down.
- Press the double start button, the panel platform moves to the bonding position, press down, and bond.
- After the bonding is completed, the platform moves to the next bonding position, and the segment bonding is completed and returns to the unloading position for manual unloading.
Parameters
| Input Power |
AC220V 50-60Hz |
Operating Mode |
HMI |
| Rated Power |
7KW LCD |
Carrier Platform |
Servo Automatic Memory Movement |
| Working Pressure |
0.4-0.8Mpa |
Counterpoint |
Manual |
| pressure Head Size |
Within L70mm |
Thermocouple |
K Type |
| Heating Method |
Thermostatic |
Rolling Method |
Automatic Roll-Up |
| Program Control |
PLC+ Servo + Automatic Vision |
Visual System |
CCD*4 |
| Available |
Within 32 inch |
Position Calibration |
X-Y-θ-H Automatic Correction |
| Weight |
About 2000KG |
Overall Dimensions |
L2300*W2000*H2300mm |
Features
- UVW alignment mechanism: automatic visual system correction is adopted to improve the bonding accuracy.
- Bonding pressure mechanism: the pressure head is equipped with a self-weight elimination mechanism to make the output more stable, and is equipped with an automatic skin rolling function.
- Level adjustment mechanism: precision slide adjustment platform, short machine adjustment time and convenient operation.
- H level precision measurement and correction mechanism: the equipment is equipped with a high-precision height gauge to effectively improve the bonding efficiency.
- OLB/PWB alignment mechanism: servo drive platform, can adapt to FOG&FOB two processes.
- Side suction feeding mechanism: changed the traditional front bonding process, and realized the side bonding process.
