Hong Kong Tiptop Technology Co., Ltd.

As the demand for high-performance displays in smartphones, tablets, automotive panels, and industrial equipment continues to rise, the need for advanced bonding technology has become more critical than ever. Among the leading providers in this field, Hong Kong TIPTOP Technology Co., Ltd. has earned recognition as a trusted COG bonding machine supplier, delivering precision equipment that supports the next generation of display manufacturing.

As electronic devices continue to advance, display technology has become more sophisticated, demanding precise and reliable assembly methods. One critical innovation in this field is the COG bonding machine, a specialized piece of equipment used in the production of high-resolution LCD and OLED panels.

In the rapidly advancing semiconductor and display industries, precision equipment has become the cornerstone of innovation. Among these technologies, FOG (Film on Glass) and OLB (Outer Lead Bonding) Main-Press Bonding Machines are essential for ensuring reliable connections in high-performance electronic devices. As demand for advanced bonding solutions rises, TIPTOP is emerging as a trusted supplier providing high-quality and durable equipment to global manufacturers.

In the fast-evolving world of semiconductor packaging and display manufacturing, OLB (Outer Lead Bonding) and FOG (Film on Glass) bond machines are gaining growing attention. These machines play a critical role in connecting integrated circuits and display driver ICs to flexible substrates or glass panels, ensuring high precision, reliability, and performance in modern electronic devices.

Why we have a varity of heads beause we have to meet all client requirements.

The thread of the screw is different. There is a triangular tooth self-tapping locking screw. It has the same pitch and angle as the metric thread, but the section is a triangle, with D and C values 2 parameters that control the locking.