Hong Kong Tiptop Technology Co., Ltd.

During mass production with water glue laminating machines, vacuum degree serves as a core critical parameter that determines lamination precision, eliminates air bubbles and guarantees product yield.

The service life, operational stability and lamination yield of integrated laminators are determined by multiple factors. Its failure rate is governed by three core dimensions.

Bubble defects frequently occur in the protective film lamination process using non-standard optical laminators.

COG is the abbreviation of Chip on Glass, formally defined as chip-on-glass flip chip bonding process, which serves as the core IC mounting procedure for display modules.

The manual dispenser is compatible with all types of particle-free fluids. A diaphragm structure is adopted at fluid contact sections instead of oil seals to prevent fluid backflow.

This equipment adopts full lamination process to realize hard-to-hard bonding between touch panels and display panels via optical clear adhesive (OCA/OCR) for integrated screen encapsulation, widely deployed in medium & large-size display module lamination.