1. Equipment Introduction
The manual dispenser is compatible with all types of particle-free fluids. A diaphragm structure is adopted at fluid contact sections instead of oil seals to prevent fluid backflow. Equipped with adjustable dispensing flow, this machine features compact size, light weight, long service life, low failure rate and easy maintenance, which is widely applied for PCB solder paste dispensing operations.
2. Pre-operation Preparation
1.Material Loading: Fill the 5cc plastic syringe with solder paste. Select tapered plastic dispensing tips according to PCB pad specifications:
18# / 20# tips for standard pads;
23# tips for large-size pads;
16# tips (0.2 mm aperture) for fine-pitch circuits.
2.Assembly & Fixation: Install and tightly fasten the adapter connector, then place the syringe vertically on the syringe holder.
3. Power-on & Parameter Adjustment
1.Connect the main power supply and turn on the compressed air source.
2.Press the machine power button to start up; the green indicator light will illuminate.
3.Air Pressure Adjustment: Turn the pressure regulating knob clockwise to increase air pressure, and counterclockwise to reduce air pressure.
4.Dispensing Time Adjustment: Turn the time control knob clockwise to shorten single dispensing duration, and counterclockwise to extend single dispensing duration.
4. Dispensing Operation Steps
1.Lay the PCB flat on the workbench.
2.Hold the syringe and maintain a 45° angle between the dispensing tip and the PCB surface.
3.Step on the foot pedal switch; the machine will dispense fluid quantitatively per preset parameters. Complete dispensing on the whole PCB in left-to-right and top-to-bottom sequence.
5. Shutdown Procedure
1.Turn off the machine power, loosen the pressure knob counterclockwise until the pressure gauge returns to zero.
2.Fit a sealed plastic sleeve over the dispensing tip to avoid solder paste volatilization and drying.
3.Cut off the main power supply and shut down the compressed air source.
6. Safety & Operating Precautions
1.Do not invert the syringe to avoid solder paste backflow into the air pipeline.
2.Minimize air entrapment inside the syringe during solder paste filling.
3.Keep stirring and feeding tools clean without lint or impurities to prevent tip clogging. If clogging occurs, unclog the tip with 0.2~0.4 mm stainless steel wire; clean or replace the tip for severe clogging.
4.Keep the dispensing tip attached to the PCB surface at the standard 45° angle during dispensing. Fully depress the foot pedal throughout each single dispensing cycle; early release of the switch will cause incomplete dots and interrupted fluid output.
