1.LCD panels must be handled with care to avoid scratches, glass cracking, or breakage.
2.Do not touch the LCD, ITO terminals, or the mounted ACF.
3.Use a lint-free cloth with alcohol to clean contaminants on the backside of the LCD. If contaminants remain after wiping, the panel should be treated as defective.
4.The IC bonding area of the ACF must be free of any foreign particles.
5.Keep hands away from the bonding head during operation.
6.Operators must wear finger cots and electrostatic wrist straps.
7.Operators are not allowed to modify machine parameters without authorization.
8.Products with mounted ACF must undergo the COG bonding process within 24 hours.
9.Clean the bonding head, stage, and quartz strips before startup and after machine adjustment. During normal production, clean the bonding head and stage hourly, and clean the quartz strips immediately if abnormalities are observed.
10.For products with a diagonal size smaller than 75 mm, use a vacuum pen for loading and unloading. For products larger than 75 mm in diagonal, manual handling is allowed, but ensure the product terminals are not touched.
