1. Handle LCDs with care, avoiding scratches, glass breakage, etc.
2. Do not touch the LCD ITO terminals or ACF.
3. Any foreign matter on the back of the LCD must be wiped clean with a lint-free cloth dipped in C₂H₅OH; otherwise, it will be treated as defective.
4. No foreign matter is allowed in the IC BONDING area.
5. Do not place hands under the machine's pressing head.
6. Operators must wear finger cots and electrostatic wrist straps.
7. Operators are prohibited from modifying parameters on their own.
8. Products must complete the COG BONDING process within 24 hours after ACF attachment.
9. Before machine operation, the pressing head, stage, and quartz must be cleaned. Regular cleaning should be performed once every hour.
10. For products with a diagonal size of less than 75mm, use a vacuum pen for loading and unloading. For products with a diagonal size greater than 75mm, manual loading and unloading is allowed, but touching the terminals is prohibited.
