COG is the abbreviation of Chip on Glass, formally defined as chip-on-glass flip chip bonding process, which serves as the core IC mounting procedure for display modules.
Adopting Anisotropic Conductive Film (ACF) as the interconnection medium, this process thermocompression-bonds Driver IC directly onto the surface of liquid crystal substrate glass. It creates stable ohmic interconnections between the conductive bumps of Driver IC and ITO transparent conductive electrode pads on the substrate, constructing a complete driving signal path to light up and drive display panels.
Featuring excellent interface compatibility, ultra-thin and miniaturized module design, low driving voltage and low overall power consumption, the COG process delivers superior integration and reliability. It has been massed commercialized and widely adopted in small and medium-sized display terminals such as smartphones, portable digital gadgets, industrial testing instruments and automotive instrument panels.
As a professional Optical bonding equipment manufacturer, TIPTOP supplies fully mature automatic equipment solutions covering the whole COG bonding process.
