The FOG (Flexible On Glass) process involves using an FOG bonding machine to attach a flexible printed circuit board (FPCB/PCB) to a glass panel using ACF hot melt adhesive.
The entire process requires the machine to control key factors such as temperature, pressure, and time to achieve mechanical connection and electrical conduction between the LCD glass and the flexible FPCB through hot pressing. To ensure product quality, the FOG process places extremely high demands on the accuracy of ACF hot melt adhesive application, bonding pressure, bonding temperature, indenter flatness, and the parallelism between the indenter and the platform. It is essential to select a reliable FOG bonding machine, which is why TIPTOP's FOG bonding machine is your optimal choice.
