FOG (Flex On Glass) is a process where a PCB or PCBA is mounted onto a glass.
It is a bonding method that achieves mechanical connection and electrical conductivity between the LCD and the PCB or PCBA through hot pressing with ACF under specific temperature, pressure, and time conditions. To ensure product quality, the FOG process requires precise control of ACF attachment accuracy, bonding pressure, bonding temperature, planarity of the bonding head, and parallelism between the bonding head and the bonding stage.
