ACF Attachment Machines

ACF Attachment Machines XCF50-A5 is suitable for the ACF attachment process of various LCD panels and touch function glass(SENSOR GLASS), PCB/PCBA and FPC, COF, TAB in FOG and FOB processes.

Product Description

Attachment Machines

Applications

ACF Attachment Machines XCF50-A5 is suitable for the ACF attachment process of various LCD panels and touch function glass(SENSOR GLASS), PCB/PCBA and FPC, COF, TAB in FOG and FOB processes.

 

Introductions

 

  • Start the machine and adjust the corresponding parameters.
  • After the relevant parameters are set, place the product to be attached on the mobile platform.
  • Start the vacuum, and the product is firmly adsorbed by vacuum.
  • Press the double start button, and the platform moves to the bottom of the attachment head for attachment.
  • After the attachment is completed, the pressure head rises, and the pull rod peels off.
  • The platform returns to the standby position and the vacuum is turned off; after the receiving wheel is started, the cutting group starts cutting, and waits after the cutting is completed.
  • Repeat the above actions continuously.

 

Parameters

Input Power AC220V 50-60HZ Available Within 12 Inches (Customizable)
Rated Power 1.0KW Control Unit PLC
Overall Dimensions L600 X W550 X H1550mm Movement Mode Single Station, Platform In And Out
ACF Width 0.5mm-5mm Thermocouple K Type
Cutting Method Automatic Cutting (Half Cutting) Heating Method Constant Temperature Heating

 

Features

 

  • Vacuum waste collection mechanism, production waste is automatically vacuumed and taken away by the machine.
  • 40-degree bevel cutter mechanism ensures machine stability and ensures accurate cutting.
  • Double-wheel pressing and feeding mechanism, cylinder controls pressure to ensure product accuracy.
  • Linear slider push rod mechanism, which makes it easy to peel ACF and prevent ACF material strip from wrinkling.
  • Buffer material mechanism, which makes it easy to replace silicone skin and has low cost for customers.
  • Temperature control mechanism, which adjusts the bonding temperature according to different product characteristics to ensure product yield.
  • ​The pressure head pressure adjustment mechanism adjusts the pressure head according to the characteristics of different products to ensure that the ACF is fully attached.
  • The adjustable limit wheel mechanism adjusts and controls the ACF attachment position in a timely and correct manner to ensure the product attachment accuracy.
  • The PCB support mechanism, the movable support frame, can be freely disassembled according to the needs of attachment.
  • The platform fine-tuning mechanism fine-tunes the platform according to the size and thickness of the attached product to ensure the product attachment yield.
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