COG Bonding Auto Alignment Bonding Machine

COG Bonding (Auto Alignment) Bonding Machine XCH87-A8 is suitable for various FPC, COF, TAB and LCD PANEL automatic alignment pre-pressure; it is also suitable for driving IC and LCD PANEL automatic pre-pressure in COG process.

Product Description

Applications

COG Bonding (Auto Alignment) Bonding Machine XCH87-A8 is suitable for various FPC, COF, TAB and LCD PANEL automatic alignment pre-pressure; it is also suitable for driving IC and LCD PANEL automatic pre-pressure in COG process.

 

Widely used in: large-size LCD screen FOG assembly bonding, COG assembly bonding and other fields.

 

Introductions

 

  • After the machine is turned on and reset, all motion axes return to standby mode;
  • Enter the HMI, click on the automatic mode and stage reset;
  • Place the Panel&Glass on the stage, click the platform vacuum button and firmly adsorb it;
  • Place the COF on the fixture, click the COF vacuum button and firmly adsorb it;
  • Start the left and right start switches with both hands, and the LCD stage will automatically move to the designated working area and take pictures of the LCD bonding area;
  • The feeding axis runs to the feeding position, the pre-pressing head (Z axis) runs down to the suction position, stops and turns on the vacuum to absorb COF;
  • The feeding axis returns to the standby position after breaking the vacuum, and the pre-pressing head (Z axis) rises to the photo position to take a photo of COF and automatically aligns;
  • After the alignment is completed, the pre-pressing head (Z axis) runs down to the pre-pressing position to bond COF, and after bonding is completed, the COF vacuum is broken and returns to the standby position;
  • The platform automatically moves to the local pressure area for local pressure bonding;
  • After bonding is completed, the LCD carrier will automatically run to the next designated area for reciprocating work.

 

Parameters

Input Power AC220V  50-60HZ Operating Mode HMI
Rated Power 5KW LCD Carrier Platform Servo Automatic Memory Movement
Working Pressure 0.4-0.8Mpa Counterpoint Auto
Pressure Head Size Withing 70mm Thermostatic Thermocouple K Type
Heating Method Thermostatic Or Pulse Heating (Optional) Rolling Method Auto Roll-up
Program Control PLC +Servo+ Automatic Vision visual system C/L CCD*2
Available Within 85 Overall Dimensions L2200*W1800*H1750mm
Weight 400kg    

 

Features

 

  • Automatic visual system, bonding accuracy 5um
  • Servo-driven COF feeding mechanism, stable and high-speed, can adapt to FOG and COG processes
  • Precision slide adjusts CCD mechanism, short machine adjustment and changeover time and convenient operation
  • Up and down automatic skin rolling mechanism, can meet the requirements of no friction between the tape and the blade, and full contact with the silicone skin during bonding
  • Independent configuration of 1 LCD key vacuum area to ensure firm adsorption of products during bonding
  • The carrier movement adopts high-precision guide sliders with high repeat positioning accuracy
  • LCD tray mechanism, horizontal to ensure that LCD does not deform
  • X-Y-Z high-precision servo transmission mechanism cooperates to meet the needs of automatic bonding action
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