Applications
COG Bonding Machine Pre-Press XCG80-A5 is suitable for bonding various LCD glass and driver IC COG.
Widely used in: various LCD screens, touch screens, and bonding production processes.
Introductions
- Manually place the IC tray on the IC fixture.
- The IC pre-pressing head absorbs the IC through the X-Y-Z axis and reaches the top of the CCD camera, and the camera is taken.
- Manually place the glass on the platform, vacuum adsorb, the platform reaches the top of the CCD, manually adjust the glass, and start pressing after the alignment is OK.
- After the pre-pressing is completed, the platform automatically reaches the bottom of the current pressing station and automatically presses down.
- After the pressing and bonding is completed, return to the standby position.
- Repeat the above actions.
Parameters
| Input Power |
AC220V 50-60HZ |
Pressure Head Mechanism |
1 Set Of Pre-Pressing Head, 1 Set Of Main Pressing Head |
| Rated Power |
3.5KW |
LCD Carrier Platform |
Motor Drive |
| Working Pressure |
0.4-0.8Mpa |
Program Control |
PLC |
| Counterpoint |
Manual Alignment, CCD Bottom Alignment |
Overall Dimensions |
L1100*W1320*H1750mm(Does Not Include Alarm Light) |
| Security Protection |
Electrostatic Protection + Grating Protection + Leakage Protection |
Weight |
750kg |
Features
- HMI: conveniently set and display various parameters; such as platform in and out speed, laminating time, etc.
- Operation control button: use key operation for common functions, use double start switch to effectively protect against misoperation. When the machine is running, the grating protection range senses that the machine is suspended.
- X-Y-O alignment mechanism: the alignment platform can be accurately fine-tuned through the X-Y-O micrometer. there is an initial correction function after IC absorption.
- Automatic IC grabbing mechanism: IC can be automatically grabbed through the X-Y-Z axis and array grabbing can be realized. CCD can be fine-tuned through X-Y-Z micro-adjustment.
- Main pressing mechanism: the pre-main pressing mechanism is separated to realize automatic skin rolling, and the skin rolling can be placed manually to improve efficiency. The back plate can be heated from the bottom, and it is equipped with a PCB support structure, which is more convenient for maintenance operations
