COG Bonding Machine Main-Press

COG Bonding Machine Main-Press XCG87-A8 is suitable for COG  pre-press bonding of various LCD glass and driver IC . It is widely used in COG repair, assembly and bonding of medium and large size LCD screens.

Product Description

Applications

COG Bonding Machine Main-Press XCG87-A8 is suitable for COG  pre-press bonding of various LCD glass and driver IC . It is widely used in COG repair, assembly and bonding of medium and large size LCD screens.

 

Introductions

 

  • Manually place the IC on the IC platform with a suction pen, turn on the vacuum adsorption, the IC platform moves to the bottom of the pre-pressing head, and the pre-pressing head descends to adsorb.
  • After the pre-pressing head absorbs the IC, it presses down to the photo position, and returns to the starting position after the photo is taken.
  • Manually place the glass on the platform, vacuum adsorb, and automatically adjust the alignment through CCD.
  • After the alignment is completed, the pre-pressing head presses down.
  • After the pre-pressing head is pressed down, the Y axis moves to the bottom of the current press head and presses down.
  • After the current press is completed, return to the standby position; repeat actions 1 to 5.

 

Parameters

Input Power AC220V  50-60HZ operating Mode HMI
Rated Power 3.5KW LCD Carrier Platform Servo Automatic Memory Movement
Working Pressure 0.4-0.8Mpa Counterpoint Auto
Pressure Head Size Within L45mm Thermocouple K Type
Heating Method Thermostatic Rolling Method Auto Roll-Up
Program Control PLC +Servo+ Automatic Vision Available Within 32 inch(Can Be Customized)
Weight 360KG Overall Dimensions L2300*W2000*H2300mm

 

Features

 

  • CCD mechanism: automatic visual system correction is adopted to improve the bonding accuracy.
  • Main pressing mechanism: the pressing head is equipped with a self-weight elimination mechanism to make the output more stable, and is equipped with an automatic skin rolling function.
  • x-y-θ alignment platform mechanism: the platform adopts X-Y-θ three-axis automatic control to ensure the accurate alignment of the machine.
  • Pre-pressing mechanism: after the IC is discharged, the pre-pressing head automatically absorbs the IC and corrects the alignment, and is equipped with a motor + cylinder mechanism to better eliminate the self-weight.
Send Inquiry
For inquiries about our products or pricelist, please leave your email to us and we will be in touch within 24 hours.

Verify Code