COG Bonding Machine Pre and Main-Press

Applications

COG Bonding Machine(Pre & Main-Press) XCG80-A3 is suitable for COG pre-press bonding of various LCD glass and driver IC. It is widely used in COG repair, assembly and bonding of medium and large size LCD screens.

Introduction

• The machine is turned on，and all moving components return to standby mode.
• Place the IC on the IC platform manually with a suction pen, turn on the vacuum adsorption, the IC platform moves to the bottom of the pre-pressing head, and the pre-pressing head descends for adsorption.
• After the pre-pressing head absorbs the IC, it presses down to the photo position, and returns to the starting position after the photo is OK.
• Place the glass on the platform manually, vacuum adsorb and take photos, and manually adjust the X-Y-θ alignment through CCD.
• After the alignment is completed, press the start button and the pre-pressing head presses down.
• After the pre-pressing head is pressed down, the Y axis moves to the bottom of the pre-pressing head for the current press.
• After the current press is completed, return to the standby position; repeat the above actions.

Parameters

Features

• CCD visual alignment group, the machine adopts CCD visual alignment, and the alignment accuracy can reach 3-5UM.
• IC feeding group, the fine-tuning frame device can be adjusted freely.
• IC pre-pressing group, the motor + cylinder eliminate the deadweight alignment crimping to ensure the crimping accuracy.
• IC main pressing group, using high-precision guide rails and sliders to ensure accuracy.
• Automatically enter and exit the platform; the platform movement meets the separation of pre-pressing and main pressing.
• Teflon skin rolling mechanism, added to the main pressing head, can ensure the flatness of the indentation.