FOG is a processing method that achieves mechanical connection and electrical conduction between liquid crystal glass and flexible printed circuits through ACF, along with hot pressing under specific temperature, pressure, and duration.
To meet various functional demands in the market, there are manual bonding, automatic bonding, single-station bonding, dual-station bonding, and heated bonding options. So, how should we make the right choice?
With China’s electronics industry expanding rapidly, the demand for advanced display manufacturing equipment has never been greater. Among the key players in this sector, Hong Kong TIPTOP Technology Co., Ltd. has established itself as a trusted COG bonding machine supplier in China, serving both domestic and international markets with high-quality, precision solutions.
As the demand for high-performance displays in smartphones, tablets, automotive panels, and industrial equipment continues to rise, the need for advanced bonding technology has become more critical than ever. Among the leading providers in this field, Hong Kong TIPTOP Technology Co., Ltd. has earned recognition as a trusted COG bonding machine supplier, delivering precision equipment that supports the next generation of display manufacturing.
As electronic devices continue to advance, display technology has become more sophisticated, demanding precise and reliable assembly methods. One critical innovation in this field is the COG bonding machine, a specialized piece of equipment used in the production of high-resolution LCD and OLED panels.
In the rapidly advancing semiconductor and display industries, precision equipment has become the cornerstone of innovation. Among these technologies, FOG (Film on Glass) and OLB (Outer Lead Bonding) Main-Press Bonding Machines are essential for ensuring reliable connections in high-performance electronic devices. As demand for advanced bonding solutions rises, TIPTOP is emerging as a trusted supplier providing high-quality and durable equipment to global manufacturers.
In the fast-evolving world of semiconductor packaging and display manufacturing, OLB (Outer Lead Bonding) and FOG (Film on Glass) bond machines are gaining growing attention. These machines play a critical role in connecting integrated circuits and display driver ICs to flexible substrates or glass panels, ensuring high precision, reliability, and performance in modern electronic devices.
Safety features such as light curtains, double start buttons, and emergency stop buttons provide multi-level protection for operational safety.
Laminating machines consist of various units such as unwinding units, glue dispensing units, transport and pressurization units, and drive motors.
FOG (Flex On Glass) is a process where a PCB or PCBA is mounted onto a glass.
Cleaning the Conveyor Belt of the Bonding Machine: To ensure the service life of the conveyor belt, after each use, clean it thoroughly using the original manufacturer's specialized cleaning solution for maintenance.
Due to the consignee's epidemic situation, this shipment was finally delivered.
