Double Head FOG and FOB Bonding Machine

Double Head FOG/FOB Bonding Machine XCH87-A6 is suitable for various FPC, COF, TAB and LCD PANEL, TOUCH PANEL, EPD PANEL and PCB multi-station assembly bonding.

Product Description

Applications

Double Head FOG/FOB Bonding Machine XCH87-A6 is suitable for various FPC, COF, TAB and LCD PANEL, TOUCH PANEL, EPD PANEL and PCB multi-station assembly bonding.

 

Widely used in FOG, FOB, OLB, PWB bonding processes of medium and large sizes in production and maintenance. Especially suitable for FOG and FOB bonding of large-size borderless LCD displays.

 

Introductions

 

  • Turn on the machine and reset the platform to the origin, enter automatic mode.
  • Click the total standby position, and the machine axes return to the standby position.
  • Place the glass on the platform, turn on the vacuum, and firmly adsorb the glass on the platform.
  • Click FOG start. The platform moves to the FOG shooting position and the glass is aligned.
  • Place the FPC or COF on the fixture and turn on the vacuum to adsorb the FPC or COF to the fixture.
  • Manual pre-press after the FPC or COF is aligned with the glass.
  • Click the FOG start button, the platform reaches the bonding position, and the pressure head presses down. When the bonding time is up, FOG bonding is completed. The pressure head rises and the platform automatically returns to the standby position.
  • Click the FOB start button, the platform reaches the FOB standby position, and uses the infrared light to locate. After the positioning is completed, click FOB start, and the platform reaches the FOB bonding position. The pressure head presses down, and the bonding time is up and the bonding is completed. The pressure head rises and the platform returns to the standby position.

 

Parameters

Input Power AC220V  50-60Hz Pressure Head Mechanism Double Pressure Head and Double Cylinder Structure
Rated Power 6.5KW LCD Stage Bakelite Stage + Automatic Movement (X-Y axis)
Working Pressure 0.4~0.8Mpa Program Control LG-PLC
Pressure Head Size L100mm(Can be Customized) Overall Dimension L2610*W2032*H1575mm
Heating Method Constant Temperature/Pulse(Optional ) Body Structure All-in-one
Available Within 85 Inch(Can be Customized) Visual System CCD Up and Down Counterpoint

 

Features

 

  • Double cylinder mechanism eliminates the self-gravity of the pressure head and has high output precision.
  • The pressure head can be adjusted independently in a single direction, which is fast and convenient.
  • The carrier moves with a high-precision guide slider.
  • The LED light source can be adjusted according to needs, suitable for clear imaging of various objects.
  • The infrared light is convenient for quickly determining the position of the COF and PCB bonding area.
  • The pre-pressure manual valve is convenient for the up and down movement of the pressure head when debugging the machine.
  • The carrier moves the lever, without frequent human-machine interface operations.
  • The upper and lower XYZ precision slide adjusts the camera, which is convenient and fast to debug the machine, and the image is clear.
  • The X-Y axis servo motor drives the LCD carrier to move accurately to the bonding area, especially suitable for batch maintenance and production.
  • An independent vacuum pump is configured to save air pressure loss, ensure firm adsorption of the product, and use aviation plug connectors for connection, which is safe and convenient.
  • The alignment of COF and LCD PANEL is completed by adjusting X-Y-θ through the micrometer mechanism.
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