Bonding Machine
Applications
Heat Press Bonding Machine XCH80-B3 is suitable for hot pressing bonding of various LCD panels , touch function glass, PCB/PCBA and FPC, COF, TAB in FOG and FOB processes.
Introductions
- Reset after powering on. Place the GLASS/FILM on the work platform, position it through the fixture, and press the vacuum button after positioning is OK.
- Place the FPC on the fixture, press the vacuum button after positioning is OK, and manually adjust the micrometer through the CCD for alignment.
- After alignment is completed, press the double start button, the platform moves under the pressure head, and the pressure head is lowered and bonded.
- Repeat the above actions continuously.
Parameters
| Input Power |
AC220V 50-60Hz |
Rated Power |
3.5KW |
| Working Pressure |
0.4-0.8Mpa |
Operating Mode |
HMI+PLC Control |
| Heating Method |
Constant Temperature Heating, K-type Thermocouple |
Movement Style |
Double Station Platform In And Out |
| Temperature Range |
RT-500℃ (Adjustable) |
Program Control |
PLC |
| Counterpoint |
Lower Position (Upper And Lower Swap) |
Available |
Within 12 inch(Can Be Customized) |
| Overall Dimension |
L800* W615*H1715mm |
Workstations |
Double Workstations |
Features
- The independent temperature control system of the pressure head can control the temperature and pressure of the left and right stations respectively.
- The precision pressure head pressure adjustment group and the digital pressure components ensure the accuracy of the pressure.
- The double-station mechanism effectively improves the production efficiency of the product.
- The front and rear moving platform mechanism and the fine-tuning frame can adjust the XYθ direction, which is more convenient to use.
- Independent pressure head cylinder controls the output of a single pressure head to ensure the accuracy of pressure head pressure and product bonding yield.
- Automatic skin rolling mechanism, strong compatibility, flexible and convenient.
- Air pressure buffer mechanism, which can eliminate the gravity of the pressure head itself.
