FOG or FOB Bonding Machine

FOG/FOB Bonding Machine XCH91-B5 is suitable for various FPC, COF, TAB and LCD panel , touch panel, electronic ink display and PCB multi-station assembly bonding.

Product Description

Applications

FOG/FOB Bonding Machine XCH91-B5 is suitable for various FPC, COF, TAB and LCD panel , touch panel, electronic ink display and PCB multi-station assembly bonding.

 

Widely used in medium and large size LCD panel, touch panel, electronic ink display in the production and maintenance process of FOG, FOB, OLB, PWB bonding process.

 

Introductions

 

  • Return to the origin after power on, move the left platform to the middle of the machine, and pre-align the product.
  • Place the panel on the workbench, turn on the vacuum to firmly adsorb the panel.
  • Place the COF, PCB, and FPC on the fixture, adsorb them, and manually adjust the X-Y-θ through the CCD for alignment; after the alignment is OK, press the start button.
  • Move the platform to the left under the pressure head, press down to bond.
  • Synchronously move the right platform to the left to the middle of the machine, and pre-align the product.
  • Place the COF, PCB, and FPC on the fixture, adsorb them, and manually adjust the X-Y-θ through the CCD for alignment; after the alignment is OK, press the start button.
  • Move the right platform to the right under the pressure head, press down to bond.
  • Move the left platform to the middle of the machine and repeat the above actions.

 

Parameters

Input Power AC380V 50-60HZ Available 21inch(Can Be Customized)
Rated Power 15KW Control Unit HMI
Overall Dimension L3100*W1100*2050mm Relocation method Manual Visual Alignment
Program Control PLC+Servo Weight 1200KG
Bonding Method Cylinder + Servo Motor Vacuum Treatment Built-in Vacuum
Workstations Double Station Rolling Wheel Automatic(Adjustable)

 

Features

 

  • The tool head of the machine instrument group can control pressure, temperature etc. individually to ensure higher yield and stability.
  • Multi-stage X-axis stage, double stations, Z platform, meet FOG, FOB, OLB, PWB, and other process multi-stage bonding.
  • The double station platform shares 1 set of CCD, and only 1 operator is required for bonding, which greatly reduces labor costs.
  • The motor-driven pressure head group adopts servo motor and cylinder mechanism to achieve zero deadweight effect.
  • The pressure heads of the pressure head group can be adjusted and controlled individually, and the minimum spacing of the pressure heads can reach 5~10MM.
  • X-Y-θ fixture group, PCB board vacuum suction, to achieve fast positioning and improve efficiency.
  • The automatic rolling wheel can automatically roll the hot pressing skin after bonding is completed, and the frequency and length can be set
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