Applications
FOG/FOB Bonding Machine XCH77-A5 is suitable for hot pressing bonding of various LCD panels ,sensor glass, PCB, PCBA and FPC, COF, TAB in FOG and FOB processes.
Introductions
- The machine is powered on and reset.
- Place the Panel on the workbench and turn on the vacuum to firmly fix it.
- Place the FPC on the fixture and turn on the vacuum to firmly fix it.
- Turn over the FPC fixture and manually adjust the X-Y--θ for alignment.
- Press the double start button, press down, and bond.
- After bonding, the platform automatically moves to the next bonding position for bonding
Parameters
| Input Power |
380V 50-60HZ |
Pressure Head Mechanism |
Cylinder |
| Rated Power |
4.5KW |
LCD Carrier Platform |
In And Out Motor Drive |
| Working Pressure |
0.6Mpa |
Program Control |
PLC |
| Pressure Head Size |
L430*W305*H10mm (Can Be Customized) |
Overall Dimensions |
L850*W1000*H1750mm(Does Not Contain FFU) |
| Security Protection |
Electrostatic Protection + Grating Protection + Leakage Protection |
Weight |
750kg |
Features
- HMI can conveniently set and display various parameters; such as platform in and out speed, bonding time, and vacuum value.
- The FPC work platform X-Y-θ micrometer adjustment mechanism adjusts the fixture group and vacuum suction to achieve rapid positioning and improve efficiency.
- The temperature control system can achieve proportional cutting, multi-temperature zone control, and precise communication to ensure temperature accuracy.
- The video splitter can meet the imaging of products with different magnifications.
- The LED light source controller can be adjusted according to needs, suitable for clear imaging of various objects.
- The X-Y-θ pressure head adjustment mechanism is easy to adjust, and the pressure head has high horizontality; the automatic leather rolling wheel can automatically roll the hot-pressing leather after bonding is completed, and the frequency and length can be set.
- The CCD alignment mechanism uses micrometer X-Y-Z precise adjustment, and the focusing is convenient and accurate.
- The X-Y axis mechanism is controlled by the stage X-Y servo, which meets the needs of different types of products such as OGS, FILM-TP, GLASS-TP, LCD screen, electronic paper etc. in FOG, FOB, OLB, PWB, and other multi-position bonding processes.
