Applications
FOG/FOB Bonding Machine XCH77-A6 is suitable for various FPC, COF, TAB and LCD panel, touch panel , electronic ink display and PCB multi-station assembly bonding.
It is widely used in the FOG, FOB, OLB, PWB bonding process of medium and large size LCD panel, touch panel, and electronic ink display in the production and maintenance process.
Introductions
- Power on and reset, the machine returns to the origin. Click the HMI to enter the automatic mode;
- Manually load from the left, X Y Z positioning card positioning, press the vacuum, the platform absorbs the panel, and the X positioning card Z axis drops;
- Press the double start button, the panel platform moves to the visual alignment position;
- Place FPC, COF, PCB on the fixture platform, press the vacuum button to suck the product, and the panel platform Z axis drops to the bond position;
- Manually adjust the X-Y-θ fixture to align with the panel, and the alignment is completed;
- Press the double start button, the panel platform moves to the bond position, press down and bond;
- After bonding is completed, the platform moves to the next bond position (multi-stage bonding can be set), and after bonding is completed, the carrier moves to the unloading position to unload the material.
Parameters
Input Power |
380V 50-60HZ |
Pressure Head Mechanism |
Motor + Cylinder |
Rated Power |
8.5KW |
LCD Carrier Platform |
X-Y-Z 3 Shaft Motor Drive |
Working Pressure |
0.4-0.8Mpa |
Program Control |
PLC |
Pressure Head Size |
320*1.8mm (Can Be Customized) |
Overall Dimension |
L3090*W1835*H2190mm |
Heating Method |
Thermostatic |
Vacuum Treatment |
Vacuum Pump |
Available |
within 85 inches (Can Be Customized) |
Counterpoint |
Upper CCD Alignment (Upper And Lower Can Be Customized) |
Features
- 2 sets of CCD upper alignment plus crosshair display for precise alignment, and upper and lower CCD mechanisms can also be customized according to process requirements.
- Equal-proportional slitting, multi-temperature zone control, and precise communication ensure temperature accuracy.
- The coaxial light source can be adjusted according to product process requirements to meet different types of alignment imaging such as OGS, FILM-TP, GLASS-TP, LCD screens, and electronic paper.
- The left-in-left-out loading method is convenient for single-person operation in the same direction, and the X-Y-Z movable positioning card device ensures the position accuracy of the product more conveniently.
- X-Y-θ pressure head mechanism is easy to adjust. The pressure head has high horizontality; the automatic leather rolling wheel can automatically roll the hot pressing leather after bonding, and the frequency and length can be set.
- The use of windless anti-static device can reduce the demand for static electricity on products, while avoiding temperature differences and alignment caused by airflow.
- The design of 4-side safety grating protection device better ensures that operators are not injured due to operating errors.
- The X-Y-Z servo control of the carrier meets the needs of different types of products such as OGS, FILM-TP, GLASS-TP, LCD screen, electronic paper etc. in FOG, FOB, OLB, PWB, and other multi-position bonding processes.
- CCD alignment mechanism, using micrometer X-Y-Z precise adjustment, convenient and accurate focusing.
- PCB and COF brackets are used in multi-segment bonding, and the defects and inconvenience caused by gravity droop during the X-axis movement of multi-segment product bonding are eliminated.
- X-Y-θ micrometer adjustment fixture group, vacuum suction, to achieve rapid positioning and improve efficiency.