FOG and FOB Bonding Machines

FOG/FOB Bonding Machines XCM71-A6 is suitable for bonding various FPC, COF, TAB, LCD Panel and PCB.

Product Description

Applications

FOG/FOB Bonding Machines XCM71-A6 is suitable for bonding various FPC, COF, TAB, LCD Panel and PCB.

Widely used in large-size LCD screens, touch screen repair and production bonding.

 

Introductions

 

  • Turn on the machine and adjust the platform back to the origin and adjust the video splitter. Enter the automatic mode;
  • Place the glass on the platform, start the stage vacuum switch, and firmly attach the glass to the platform; The platform moves to the bonding position. Align the glass;
  • Place the FPC or COF on the fixture and start the vacuum switch to attach the FPC or COF to the fixture;
  • Manually pre-press the FPC or COF after aligning it with the glass;
  • The machine automatically rolls the skin and starts the automatic switch for bonding;
  • Bonding is completed.

 

Parameters

Input Power AC220V 50-60HZ Pressure Head Mechanism Single Pressure Head Double Cylinder Structure
Rated Power 2-4KW LCD Stage Bakelite Stage + Automatic Movement
Working Pressure 0.4-0.8Mpa Program Control PLC
Pressure Head 100*5mm (Can Be Customized) Overall Dimension L2810mm*W1735mm*H1680mm
Heating Method Thermostatic or Pulse Heating(optional) Body Structure All-in-one
Available Within 85 inch (Can Be Customized) Visual System CCD Bottom Alignment(Optional)+ Display

 

Features

 

  • FOG and FOB pressure dual-channel control, convenient to meet the different pressure requirements of two processes.
  • Double cylinder mechanism can eliminate the gravity of the pressure head, high output accuracy.
  • Pressure head adjustment single direction independent adjustment. Quick and convenient.
  • The carrier movement adopts high-precision guide slider, with high repeat positioning accuracy.
  • LED light source can be adjusted according to needs, suitable for clear imaging of various objects.
  • Video splitter can meet the imaging of products with different magnifications.
  • LCD positioning valve is convenient for each work product positioning, ensuring the accurate position of the bonding area.
  • Infrared lamp is convenient for quickly determining the position of COF and PCB bonding area.
  • Upper and lower self-weight rolling mechanism can meet the requirements of no friction of the blade when rolling, and full contact with the silicone skin when bonding.
  • The conductive copper head fixed at 3 points can ensure that the position of the cutter head remains unchanged after repeated installation and is not prone to electrical short circuit.
  • The pre-pressure manual valve is convenient for the up and down movement of the pressure head when debugging the machine.
  • The XYZ precision slide adjusts the camera, which makes the machine debugging convenient and fast, and the image is clear.
  • The servo motor drives the LCD stage to move accurately to the required bonding area, which is suitable for batch maintenance and production.
  • The independent vacuum pump is configured to save air pressure loss, ensure the product is firmly adsorbed, and use aviation plug connectors for connection, which is safe and convenient.
  • The platform moves the pull rod, no need for frequent HMI operation, the operation is intuitive and simple.
  • Pulse heating and multiple temperature zones, suitable for various bonding temperature requirements.
  • LCD platform can select vacuum area according to products of different sizes, energy-saving and convenient.
  • The machine software can store, call and set multiple parameters, such as position, time, speed, etc.
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