FOG and FOB Bonding Machine

FOG/FOB Bonding Machine XCH71-A3 is suitable for bonding various FPC, COF, TAB, LCD PANEL, TOUCH SENSOR and PCB. It is suitable for bonding large-size LCD screen repair, touch screen repair, production bonding and other fields.

Product Description

Bonding Machine

Applications

FOG/FOB Bonding Machine XCH71-A3 is suitable for bonding various FPC, COF, TAB, LCD PANEL, TOUCH SENSOR and PCB. It is suitable for bonding large-size LCD screen repair, touch screen repair, production bonding and other fields.

 

Introductions

 

  • Manually place the LCD on the platform, press the vacuum button to firmly absorb a small area of ​​the product to ensure that it does not move;
  • Manually absorb the COF with ACF glue attached to the flip fixture on the micrometer adjustment mechanism, press the vacuum button to firmly absorb the COF and flip it;
  • Adjust X-Y-θ through the micrometer mechanism to complete the alignment of COF and LCD glass;
  • Press the start button with both hands, and the pressure head mechanism descends to bond;
  • After bonding, the pressure head mechanism rises.

 

Parameters

Input Power AC220V 50-60Hz±10%50HZ 1.5KW Pressure Head Unit Single Pressure Head Double Cylinder Structure
Rated Power 1.0KW LCD Carrier Platform Glass Stage + Manual Movement
Working Pressure 0.4-0.8Mpa Program Control PLC
Pressure Head 100*5mm (Can be Customized) Overall Dimension l2200*w1620*h1650mm
Heating Method Thermostatic (Optional) Machine Structure Split Assembly
Available Within 65 inch(Can be Customized) Visual System CCD Bottom Alignment (Upper And Lower Interchangeable) + 7-Inch Display

 

Features

 

  • The pressure head mechanism adopts a double guide rail slider + bearing guide column mechanism to ensure the accuracy of the pressure head's up and down movement.
  • The micrometer vacuum flip mechanism facilitates the synchronous operation of bonding and material suction, saving working time.
  • The glass carrier can move parallel to the left and right along the guide rail, which is convenient for multi-position bonding of large-sized glass.
  • The compact LED light source design adopts an X-Y-Z adjustable mechanism, and there is no need to repeatedly adjust the light source angle during bonding.
  • The machine adopts a split assembly mechanism, which is convenient for various transportation and can meet various complex workplaces.
  • The independently designed small-area LCD vacuum adsorption mechanism solves the position offset caused by the inability of the glass platform to adsorb the product.
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