FOB and PWB Automatic Alignment Bonding Machine

FOB and PWB Automatic Alignment Bonding Machine LOA55-X3 is suitable for hot pressing bonding of various PCB, PCBA  and FPC, COF, TAB in FOB and PWB processes.

Product Description

Applications

FOB and PWB Automatic Alignment Bonding Machine LOA55-X3 is suitable for hot pressing bonding of various PCB, PCBA  and FPC, COF, TAB in FOB and PWB processes.

 

Introductions

 

  • Start the machine and adjust the corresponding parameters;
  • After the parameter setting is completed, the panel carrier moves to the receiving position, the panel is placed on the carrier, and the positioning card is in position;
  • Press the vacuum button to adsorb the panel, the positioning mechanism descends, press the double start button, and the carrier moves to the photo position;
  • Place the PCB on the fixture, click the PCB vacuum button and adsorb it firmly;
  • Click the left and right start buttons, the PCB automatically corrects the carrier and moves to the photo position;
  • After the photo is OK, the PCB automatically corrects the carrier and moves to the bonding position:
  • The panel carrier moves to the photo position to take a photo. After correction, the carrier moves to the bonding position, the hot press head heats up, presses down, the bonding time is up, the bonding is completed, and the Z axis of the press head motor rises.
  • The carrier moves to the next station and repeats the above actions. After bonding, the carrier moves to the unloading position and unloads manually.

 

Parameters

Input Power AC220V  50-60HZ Operating Mode HMI
Rated Power 10.5KW LCD Carrier Platform Servo Automatic Memory Movement
Working Pressure 0.4~0.8Mpa Counterpoint Manually
Pressure Head Size L70mmX6(can be Customized) Thermocouple K Type
Heating Method Thermostatic Rolling Method Auto Roll-up
Program Control PLC+ Servo + Automatic Vision Available L1200*500mm(Can Be Customized)
Weight 950KG Overall Dimensions L1550*W1500*H2150mm

 

Features

 

  • The platform adopts X-Y-Z-θ four-axis automatic control to ensure accurate alignment of the machine.
  • PCB alignment, CCD camera X-Y-θ correction automatic alignment.
  • The pressure head mechanism, the pressure head can select multiple sections of arbitrary positions and press down in sequence, and the pressure and temperature can be controlled separately.
  • The motor drives the pressure head, and the pressure head is equipped with a servo motor + cylinder unit to make the output more stable, and is equipped with an automatic skin rolling function.
  • The positioning mechanism adopts an oblique push positioning method, which can accurately position and prevent damage to the product.
  • The glass CCD mechanism adopts automatic visual system correction to improve the bonding accuracy.
Send Inquiry
For inquiries about our products or pricelist, please leave your email to us and we will be in touch within 24 hours.

Verify Code