Applications
FOB Bonding Machine XCH70-A6 is suitable for FOB and PWB bonding of various FPC, COF, TAB and PCB.
Introductions
- Place the panel on the workbench, turn on the vacuum suction to firmly adsorb, and the platform rises.
- Place the PCB on the positioning platform, press the double start button to lower the platform.
- Manually adjust the PCB board support X-Y-θ for alignment: press the double start button, the platform moves in and out, and presses down to bond.
Parameters
| Input Power |
AC220V 50-60HZ |
Operating Mode |
HMI |
| Rated Power |
Thermostatic 3KW, Pulse 5KW |
LCD Carrier Platform |
Servo Automatic Memory Movement |
| Working Pressure |
0.4~0.8Mpa |
PCB Fixture |
X-Y-θ Micrometer adjustment |
| Pressure Head Size |
Thermostatic 70mm, pulse 60mm (selected) |
Thermocouple |
K Type |
| Rolling Method |
Auto Roll-up |
Program Control |
PLC Controller + Servo Controller |
| Visual System |
C/CCDx8 |
Heating Method |
Thermostatic or Pulse heating (optional) |
Features
- CCD upper alignment is adopted to solve the position deviation caused by the inability of the glass platform to absorb the product.
- The pressure head can select the position and press down in multiple sections at will.
- The micrometer adjustment mechanism can accurately adjust the alignment to ensure the bonding accuracy.
- The pressure adjustment mechanism can accurately adjust the temperature and pressure.
- The platform has vacuum partitions, which can be selected separately according to different sizes. The platform lifting has an optional function, and the platform has an alignment function for front and back entry and exit to meet the needs of different products.
- Safety control mechanism, safety protection can be achieved through safety grating when the machine is running.
