Double Heads Constant Temperature Bonding Machine

Applications

Double Heads Constant Temperature Bonding Machine XCH80-B3 is suitable for the hot pressing of various liquid crystal screens (LCD PANEL), touch function glass (SENSOR GLASS), hard circuit boards (PCB/PCBA) and flexible circuit boards (FPC, COF, TAB) in the FOG and FOB processes.

Introductions

• Reset after power on.
• Place the glass/FILM on the working platform, position it through the fixture, and then press the vacuum button after positioning OK.
• Place the FPC on the fixture, position it OK and press the vacuum button to manually adjust the micrometer through the CCD for alignment.
• After the alignment is completed, press the double-start button, the platform enters below the pressure head and presses down on Bunding.
• Continue to repeat the above actions.

Parameters

Features

• The head heating temperature control group and the double head independent temperature control system can control the temperature and pressure of the left and right working stations respectively.
• Precision head pressure adjustment group, digital pressure components ensure the accuracy of pressure.
• Dual-station mechanism effectively improves product production efficiency.
• The front and rear mobile platform mechanism, and the fine-tuning frame can adjust the XYθ direction, making it easy to work.
• The head cylinder, the independent head cylinder controls the output of a single head to ensure the accuracy of the head pressure and the product yield.
• Automatic rolling mechanism, strong compatibility, flexible and convenient.
• The air pressure buffer mechanism can eliminate the gravity of the pressure head itself.