Applications
FOG and OLB Main-Press Bonding Machines LOA55-A2 is suitable for multi-station assembly bonding of various FPC, COF, TAB and LCD screens, touch screens, electronic ink displays and PCBs. It is widely used in the FOG and OLB bonding process of medium and large-sized LCD screens, touch screens, and electronic ink displays during production and maintenance.
Introductions
- Start the machine and set the corresponding parameters. After the relevant parameters are set, the panel carrier moves to the receiving position, the panel is placed on the carrier, the positioning card is aligned, and the CCD assists in alignment.
- After the alignment is OK, press the vacuum button to adsorb the panel, the Y-axis positioning card drops, press the double-hand start button, and the carrier moves to the bonding position.
- The pressure head is pressed down, the bonding time is up and the bonding is completed, and the pressure head motor Z axis rises.
- Manual unloading, repeat the above actions.
Parameters
Input Power |
AC220V 50-60HZ |
Operating Mode |
HMI |
Rated Power |
15KW |
LCD Carrier Platform |
Servo Automatic Memory Movement |
Working Pressure |
0.4~08Mpa |
Counterpoint |
Manual |
Pressure Head Size |
L65*5mm(Can Be Customized) |
Thermocouple |
K Type |
Heating Method |
Thermostatic |
Rolling Method Auto |
Auto |
Program Control |
PLC+Servo+Automatic Vision |
Available |
1200X500mm(Can Be Customized) |
Weight |
2200KG |
Overall Dimension |
L1660*W2000*H2170mm |
Features
- The back up mechanism is designed as a whole, the bonding position can be selected arbitrarily, and there is a heating function underneath.
- The pressure head structure can be adjusted and controlled separately, and the minimum spacing of the pressure heads can reach 5-10mm;
- The platform mechanism can adjust X-Y-Z and save parameters, which is convenient for switching product models.
- The CCD auxiliary alignment mechanism adopts a precision fine-tuning frame for precise adjustment, and the focusing is convenient and accurate.
- The manual operation interface is convenient to set and can display various parameters, such as bonding speed, bonding position etc