Applications
FOG and OLB Main-Press Bonding Machine LOA32-X1 is suitable for multi-station assembly bonding of various FPC, COF, TAB and LCD screens, touch screens, electronic ink displays and PCBs. It is widely used in FOG, FOB, OLB, PWB bonding processes in the production and maintenance of medium and large-sized LCD screens, touch screens, and electronic ink displays.
Introductions
- Start the machine and set the corresponding parameters. After the parameter setting is completed, the panel carrier moves to the receiving position, the panel is placed on the carrier, the positioning card is positioned, and the CCD assists in the alignment.
- After the alignment is OK, press the vacuum button to adsorb the panel, the Y-axis positioning is lowered, press the double start button, and the carrier moves to the bonding position.
- The pressure head is pressed down, the bonding time is up and the bonding is completed, and the pressure head motor Z axis rises.
- Manual unloading, repeat the above actions.
Parameters
| Input Power |
AC220V 50-60HZ |
Operating Mode |
HMI |
| Rated Power |
10KW |
LCD Carrier Platform |
Servo Automatic Memory Movement |
| Working Pressure |
0.4~0.8Mpa |
Counterpoint |
Manual |
| Pressure Head Size |
L65*5mm (Can Be Customized) |
Thermocouple |
K Type |
| Heating Method |
Thermostatic |
Rolling Method |
Auto |
| Program Control |
PLC+ Servo + Automatic Vision |
Available |
Within 32 inch(Can Be Customized) |
| Weight |
2200KG |
Overall Dimension |
L1660*W2000*H2170mm |
Features
- Each set of cutter heads can be individually controlled by the machine instrument mechanism, such as pressure and temperature, to ensure higher bonding yield and machine stability.
- The motor-driven pressure head mechanism is composed of a servo motor and a cylinder.
- The pressure head mechanism can be individually adjusted and controlled, and the minimum spacing of the pressure heads can reach 5~10mm; it is equipped with an automatic leather rolling wheel, and the hot-pressing leather can be automatically rolled after bonding is completed, and the frequency and length can be set.
- The positioning mechanism adopts an oblique push positioning method, which can accurately position and prevent damage to the product.
- The platform mechanism X-Y-Z can be adjusted and parameters can be saved, which is convenient for switching product models.
- The back up mechanism is a whole design, the bonding position can be selected arbitrarily, and it is equipped with a heating function below.
