Applications
FOG and FOB Bonding Machine (Borderless) XCH87-A6 is suitable for multi-station assembly bonding of various FPC, COF, TAB and LCD screens, touch screens, electronic ink displays and PCBs.
Widely used in FOG, FOB, OLB, PWB bonding processes of medium and large-sized LCD screens, touch screens, and electronic ink displays during production and maintenance. Especially suitable for FOG and FOB bonding of large-sized borderless LCD display.
Introductions
- Turn on the machine and reset the platform back to the origin, and enter automatic mode.
- Click the standby position, and the machine axes return to the standby position.
- Place the glass on the platform, start the stage vacuum switch, and firmly adsorb the glass on the platform.
- Click FOG start. The platform moves to the FOG shooting position, and the glass is aligned.
- Place the FPC or COF on the fixture and start the vacuum, and the FPC or COF will be adsorbed on the fixture.
- Manually pre-press the FPC or COF after aligning it with the glass.
- Click the FOG button, the platform reaches the FOG bond position, the pressure head presses down, the bonding time is up, the FOG bonding is completed, and the pressure head rises. The platform automatically returns to the standby position.
- Click the FOB button, the platform reaches the FOB standby position, and uses the infrared light to locate. Click FOB button, the platform reaches the FOB bond position, the pressure head presses down, the bonding is completed, and the pressure head rises. The platform returns to the standby position.
Parameters
| Input Power |
AC220V 50-60Hz |
Pressure Head Mechanism |
Double Pressure Head and Double Cylinder Structure |
| Rated Power |
6.5KW |
LCD Carrier |
Bakelite Stage+Automatic Movement (X-Y axis) |
| Working Pressure |
0.4~0.8Mpa |
Program Control |
LG-PLC |
| Pressure Head Size |
L100mm (Can Be Customized) |
Overall Dimension |
L2610*W2032*H1575mm |
| Heating Method |
Thermostatic/Pulse(Optional) |
Body Structure |
All-in-one Machine |
| Available |
Within 85 inch(Can Be Customized) |
Visual System |
CCD Up and Down Counterpoint |
Features
- The double cylinder mechanism can eliminate the gravity of the pressure head itself, and the output precision is high.
- The pressure head is easy to adjust, and the single direction can be adjusted independently, which is fast and convenient.
- The platform moves with a high-precision guide slider.
- The LED light source can be adjusted according to needs, suitable for clear imaging of various products.
- The infrared light is convenient for quickly determining the position of the COF and PCB bonding area.
- The pre-pressure manual valve is convenient for the up and down movement of the pressure head when debugging the machine.
- The stage moves the lever, without frequent human-machine interface operations.
- The XYZ precision slide adjusts the camera up and down, making the machine debugging convenient, fast and clear.
- The X-Y axis servo motor drives the LCD stage to move accurately to the required bonding area, which is particularly suitable for batch maintenance and production.
- An independent vacuum pump is configured to save air pressure loss, ensure that the product is firmly adsorbed, and use aviation plug connectors for connection, which is safe and convenient.
- The COF and LCD are aligned by adjusting X-Y-θ through the micrometer mechanism.
