OLB and FOG Bond Machines

OLB and FOG Bond Machines XCH71-A3 is suitable for various combinations of FPC, COF, tab and LCD display (LCD panel), touch screen function tablet (TOUCH SENSOR) and PCB.

Product Description

Bond Machines

Applications

OLB and FOG Bond Machines XCH71-A3 is suitable for various combinations of FPC, COF, tab and LCD display (LCD panel), touch screen function tablet (TOUCH SENSOR) and PCB.

Widely used in: large-size LCD screen repair and customs, touch screen repair and customs, production and customs, etc.

 

Introductions

 

  • Manually place the LCD glass on the platform, press the vacuum button to adsorb the product in a small area firmly to ensure no displacement;
  • Manually adsorb the COF with ACF glue attached to the flip fixture on the micrometer adjustment mechanism, press the vacuum button to adsorb the COF firmly and flip it;
  • Adjust X-Y-θ through the micrometer mechanism to align COF with liquid crystal glass;
  • Start the button with both hands, and the head pressing mechanism is lowered;
  • The bonding is completed and the head mechanism is rising.

 

Parameters

Input Power Supply AC220V 50-60Hz±10%50HZ 1.5KW Head Mechanism Single Head Double Cylinder Structure
Rated Power 1.0KW LCD Stage Glass Stage + Manual Movement
Working Air Pressure 0.4-0.8Mpa Program Control Domestic PLC
Instrument Head Size 100*5mm (Custom-Made) External Dimension L2200*W1620*H1650mm (Including Alarm Light)
Heating Method Constant Temperature Heating (Optional Pulse) Body Structure Split Assembly
Applicable Products Suitable for 65-inch (Custom-Made) Visual System CCD Lower Alignment (Upper And Lower Interchangeable) + 7-Inch Display.

 

Features

 

  • The indentation head mechanism adopts a double guide rail slider + bearing guide column mechanism to ensure the accuracy of up and down movement of the indentation head.
  • Micrometer vacuum flip mechanism facilitates synchronous operation of Binding and material suction, saving working time.
  • The glass stage can move parallel to the guide rail sub-par, making it easier to ensure large-size glass with multiple positions.
  • The compact LED light source design adopts an X-Y-Z adjustable mechanism, so there is no need to repeatedly adjust the light source angle during bonding operation.
  • The machine adopts a split assembly mechanism, which is convenient for various handling and can meet various complex workplaces.
  • Independently designed small-area LCD vacuum adsorption mechanism solves the position shift caused by the inability of traditional glass platforms to adsorb products.
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