Applications
OLB and FOG Bond Machines XCH91-B5 is suitable for various FPC, COF, TAB and LCD screens (LCD PANEL) touch screens (TOUCH PANEL) and PCB multi-station assembly.
Widely used in: medium and large-size LCD screens (LCD PANEL); touch screens (TOUCH PANEL); electronic ink display screens (EPD PANEL) in the process of FOG, FOB, OLB, and PWB bonding processes.
Introductions
- After power on, return to the origin, move the left platform to the middle of the equipment, and pre-align the product.
- Place the PANEL on the workbench and turn on the vacuum to adsorb the PANEL firmly.
- Place COF, PCB, and FPC on the fixture and adsorb, and manually adjust X-Y-θ through the CCD alignment; after the alignment is OK, press the start button.
- The platform moves left to the bottom of the press head and presses down on Bunding.
- Synchronize the right platform and move left to the middle of the device, and the product is pre-aligned.
- Place COF, PCB, and FPC on the fixture and adsorb, and manually adjust X-Y-θ through the CCD alignment; after the alignment is OK, press the start button.
- The right platform moves to the right to the bottom of the pressing head and press down on Bunding.
- Move the left platform to the middle of the device and cycle again and again.
Parameters
| Input Power Supply |
AC380V 50-60HZ |
Applicable Size |
21 Inches (Customizable) |
| Rated Power |
15KW |
Control Unit |
7-inch Human-Machine Interface |
| External Dimensions |
L3100*W1100*2050mm |
Alignment Method |
Manual Visual Alignment |
| Program Control |
PLC+Servo Equipment |
Weight |
1200KG |
| Bonding Method |
Cylinder + Servo Motor |
Vacuum Treatment |
Built-In Vacuum |
| Number of Workstations |
Left And Right Double Stations |
Rolling Wheel |
Automatic Rolling (Can Be Set) |
Features
- Equipment instrumentation set, each set of tool heads can control pressure, temperature, etc. separately to ensure higher bond yield and equipment stability.
- Multi-stage X-axis loading stage, left and right dual stations, Z platform, meets multi-stage bonding of FOG, FOB, OLB, PWB, and other processes.
- CCD alignment group, the dual-station platform has a total of 1 CCD, and the dual-station allocation only requires one operator to register, which greatly reduces labor costs.
- The motor drive pressure head group adopts a servo motor and cylinder mechanism to achieve a self-weightless effect.
- In the indenter group, the indenter can be adjusted and controlled separately, and the minimum spacing of the indenter can reach 5~10MM.
- X-Y-θ fixture set, PCB board vacuum suction, achieve rapid positioning and improve efficiency.
- Automatic rolling wheel, Bonding can automatically roll the hot pressing skin, and the frequency and length can be set.
