OLB and FOG Bonding Machine

Applications

OLB and FOG Bond Machines XCH77-A6 is suitable for various FPC, COF, TAB and LCD screens (LCD PANEL) touch screens (touch PANEL) and PCB multi-station assembly.

Widely used in: medium and large-size LCD screens (LCD PANEL); touch screens (touch PANEL); electronic ink display screens (EPD PANEL) in the process of FOG, FOB, OLB, and PWB bonding processes.

Introductions

• Power on and reset, the device returns to the origin;
• Click on the human-computer interface to enter automatic mode;
• Manually load the material from the left, position the X Y Z toward the positioning card, press the vacuum, the platform adsorbs the Panel, and the X positioning card descends the Z axis;
• Press your hands to start, and the Panel platform is moved to the visual counterpoint;
• Place the FPC, COF, and PCB on the fixture platform, press the vacuum button to suck the product, and lower the Z-axis of the Panel platform to the Bang position;
• Manually adjust the fixture X-Y-θ and Panel to align the position, and the alignment is completed;
• Press the dual start button, and the Panel platform is moved to the national positioning, press down and set;
• After the government is completed, the platform moves to the next unit positioning (multiple-stage unit can be set), and the unit is completed and the platform is moved to the discharge level to the discharge level.

Parameters

Features

• The alignment of the two sets of CCDs is also equipped with cross-line displays to accurately align, and the upper and lower CCD mechanisms can also be customized according to process requirements.
• Equal proportion slitting, multi-temperature zone control, and precise communication to ensure temperature accuracy.
• The coaxial optical lens light source can be adjusted according to product process requirements, and can meet different types of alignment imaging such as OGS, FILM-TP, GLASS-TP, LCD screen, electronic paper, etc.
• The feeding method of left-in and left-out is convenient for single person to operate in the same direction, and the X-Y-Z active positioning card device more conveniently ensures the position accuracy of the product.
• X-Y-θ head adjustment mechanism, easy to adjust. The indenter has a high level; the automatic rolling wheel can be automatically rolled and the hot-pressing skin can be set. The frequency and length can be set.
• The use of windless electrostatic elimination device can reduce the demand for static electricity on the product, while avoiding temperature differences and counter-position effects caused by airflow.
• The 4-side safety grating protection device design better ensures personnel injuries caused by operating errors.
• The stage X-Y-Z servo control meets the needs of different types of products such as OGS, FILM-TP, GLASS-TP, LCD screen, electronic paper, etc. in multiple locations for FOG, FOB, OLB, PWB, etc.
• CCD alignment mechanism uses micrometer X-Y-Z to accurately adjust, making the focus easy and accurate.
• PCB and COF brackets are used in multi-stage bonding, and are disadvantages and inconveniences caused by gravity sag during the X-axis movement of multi-stage bonding products.
• X-Y-θ micrometer adjusts the fixture set, vacuum suction, achieves rapid positioning and improves efficiency.