OLB and FOG Bonding Machines

OLB and FOG Bond Machines XCM71-A6 is used for bonding variety of FPC, COF, TAB tO LCD PANEL and PCB. Widely used in large-size LCD screen repar bonding, touch screen repair bonding, production bonding and other fields.

Product Description

Applications

OLB and FOG Bond Machines XCM71-A6 is used for bonding variety of FPC, COF, TAB tO LCD PANEL and PCB.

Widely used in large-size LCD screen repar bonding, touch screen repair bonding, production bonding and other fields.

 

Introductions

 

  • Turn on the power, platform go back to original position.
  • Enter to "auto” mode.
  • Place glass on platform, turn on vacuum, then glass is attached onto platform by vacuum.
  • Platform move to bonding position.
  • Glass align.
  • Place FPC/COF on fixture, then turn on vacuum button. FPC/COF is attached on fixture by vacuum.
  • Pre-press bond after FPC/COF align with glass.
  • Automatically collect silicone rubber, press "auto" button.
  • Bonding finish.

 

Parameters

Input Power AC220V 50-60HZ Group of Pressure Head Single Pressure Head And Double Cylinders
Rated Power 2-4KW LCD Platform Movable Bakelite Plate
Working Pressure 0.4-0.8Mpa Controlling Program LG/PLC
Size of Pressure Head 100*5mm (Can Be Customized) Dimension L2810mm*W1735mm*H1680mm
Method of Heating Constant/Pulse Heating (Optional) Construction of Machine All-In-One
Available Size Within 85 Inches (Can Be Customized) Visual System Camera Bottom/Top Alignment (Optional)7 Inches Display

 

Features

 

  • Double Pressure control can satisfy 2 kind of process which are FOG and FOB.
  • Group of double cylinders can eliminate gravity of pressure head and improve precision.
  • Pressure head can be adjusted in one-way independently.
  • Platform is adopted high level quide rail and sliding blocks to ensure precision.
  • LED light source can be adjusted according to different requirement of matter.
  • Video segmentation can satisfy different time magnification.
  • Locating valve ensure precision of bonding position and can fix different products efficiently.
  • Infrared ray help to find position of bonding (COF and PCB) more promptly.
  • Collector of silicone rubber can avoid friction of cutting head when the bonding is not working. However, when bonding is working, silicone rubber can fully touch cutting head.
  • Permanent position ensures to frequently replace cutting head in same way.
  • Pre-press manual valve help pressure head movable during adjustment.
  • Camera adjusts through XYZ precision sliding table that improve efficiency.
  • Servo motor drives LCD platform that can precisely move to bonding position, especially for production and a big amount of products.
  • Independent vacuum pump can save pressure and ensure attaching more tightly.
  • Movable rod easily operate.
  • Pulse heating divide different area to fix different temperature.
  • According to different product's size, you can select different vacuum area from LCD platform.
  • The machine can set, storage and recall a number of position parameters, time parameters, speed parameters and so on.
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